OM-5300 No-Clean Tin-Lead Solder Paste, Sn63Pb37, 90-3-M17, 500g Jar

All-Spec #: 151855-1998 MFG #: 151855
$69.17 Jar-JR
Quantity Price
1 $69.17
12000 $67.44
36000 $65.80
Availability: 0 In Stock 10 days
1.00 lbs per JR Mexico
24 Item must be ordered in multiples of 1
  • Product Information
  • Technical Information

The Alpha 151855 is a Series OM5300 no-clean solder paste .

The Alpha 151855 Features:
  • Print Consistency:Lower "deposit to deposit" variation drives maximization of first pass print and reflow yields
  • Fine Feature Capability:High print deposit volumes and low volume variability down to 12 mil (0.30mm) circle feature sizes
  • Low BGA Voiding:Class III voiding resistance even when SAC 305 BGA spheres are used
  • Electrical Reliability:Exceeds the requirements of the IPC and Bellcore SIR electrical reliability tests
  • Suitable for fine pitch applications such as 0.5 mm (20mil) pitch Flip-Chip and 0201 assembly
  • Excellent response to pause performance, generating fewer defects due to start up
  • High print speed, up to 150 mm/sec (6 inch/sec)
  • Efficient activation system providing defect free soldering with a wide range of oven profiles
  • High yield for in circuit testing (low level of false negatives)
The Alpha 151855 Specifications:
  • Series: OM5300
  • Product Type: No-Clean Solder Paste
  • Physical Form: Paste
  • Chemical Composition: Sn63Pb37
  • Applications: Soldering
  • Standards Met: IPC and Bellcore SIR, IPC J-STD-005, J-STD-004, DIN Standard 32 513
  • Container Type: Jar
  • Capacity: 500g
  • Country of Origin: Mexico
  • Tariff Code: 3810.10.01
  • Carton Quantity: 500
  • Brand Name: Alpha
  • Series: OM-5300
  • Chemical Composition: Sn63Pb37
  • Product Type: No-Clean Solder Paste
  • Physical Form: Paste
  • Applications: Soldering
  • Standards Met: IPC and Bellcore SIR, IPC J-STD-005, J-STD-004, DIN Standard 32 513
  • Container Type: Jar
  • Capacity: 500g
  • Manufacturer: Alpha