Flextac Rework Stencils, Aperture Size 0.02, 0.004

All-Spec #: B4-360-2323-100-10123 MFG #: B4-360-2323-100
$66.64
$69.50
Package-PK
Quantity Price
1 $66.64
3 $63.91
Availability: 0 In Stock 7 days
0.00 lbs per PK
PK
1 Item must be ordered in multiples of 1
  • Product Information
  • Technical Information

The CircuitMedic B4-360-2323-100 is a flextac rework stencils with a pitch of 1.

The CircuitMedic B4-360-2323-100 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
The CircuitMedic B4-360-2323-100 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.004in
  • Aperture Size: 0.02in
  • Pitch: 1mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 23 x 23mm
  • Component Length: 23mm
  • Component Width: 23mm
  • Number of Balls: 360
  • Ball Pattern: 22 x 22 P5-Row
  • Package Quantity: 10PK
  • Carton Quantity: 1
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.004in
  • Aperture Size: 0.02in
  • Pitch: 1mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 23 x 23mm
  • Component Length: 23mm
  • Component Width: 23mm
  • Number of Balls: 360
  • Ball Pattern: 22 x 22 P5-Row
  • Package Quantity: 10PK
  • Manufacturer: CircuitMedic