CircuitMedic® B4-676-2727-100 Flextac BGA Rework Stencil, 1.063 x 1.063 in 10/PK

All-Spec #: B4-676-2727-100-10123 MFG #: B4-676-2727-100
$88.61
$89.50
Package-PK
Availability: 0 In Stock 8 days
0.18 lbs per PK
1 Item must be ordered in multiples of 1
  • Product Information
  • Technical Information

The CircuitMedic B4-676-2727-100 is a flextac rework stencils with a pitch of 1.

The CircuitMedic B4-676-2727-100 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
The CircuitMedic B4-676-2727-100 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.006in
  • Aperture Size: 0.02in
  • Pitch: 1mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 27 x 27mm
  • Component Length: 27mm
  • Component Width: 27mm
  • Number of Balls: 676
  • Ball Pattern: 26 x 26 Array
  • Package Quantity: 10PK
  • Carton Quantity: 1
  • Brand Name: CircuitMedic
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.006in
  • Aperture Size: 0.02in
  • Pitch: 1mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 27 x 27mm
  • Component Length: 27mm
  • Component Width: 27mm
  • Number of Balls: 676
  • Ball Pattern: 26 x 26 Array
  • Package Quantity: 10PK
  • Manufacturer: CircuitMedic