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BGA REWORK STENCIL .006 17X17 P5-ROW 10/PKG

Hisco #:B6-241-2323-127-10123

MFG #:B6-241-2323-127

Our Price: $129.00 PK
Manufacturer Lead Time When Not In Stock7 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1

The CircuitMedic B6-241-2323-127 are 23 mm long rework stencils made of polymer film. The residue-free adhesive backing prevents solder paste bleeding and the disposable stencils are laser cut to ensure an accurate aperture size.

CircuitMedic B6-241-2323-127 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
CircuitMedic B6-241-2323-127 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.006in
  • Pitch: 1.27mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 23 x 23mm
  • Component Length: 23mm
  • Component Width: 23mm
  • Number of Balls: 241
  • Ball Pattern: 17 x 17 P5-Row
  • Package Quantity: 10PK

Product Description

The CircuitMedic B6-241-2323-127 are 23 mm long rework stencils made of polymer film. The residue-free adhesive backing prevents solder paste bleeding and the disposable stencils are laser cut to ensure an accurate aperture size.

CircuitMedic B6-241-2323-127 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
CircuitMedic B6-241-2323-127 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.006in
  • Pitch: 1.27mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 23 x 23mm
  • Component Length: 23mm
  • Component Width: 23mm
  • Number of Balls: 241
  • Ball Pattern: 17 x 17 P5-Row
  • Package Quantity: 10PK

Technical Information

BrandCircuitMedic
SeriesBGA
Product TypeFlextac Rework Stencils
ApplicationsApplying Solder Paste for BGA Rework
Type of StencilFlextac Rework
Thickness0.006in
Pitch1.27mm
MaterialPolymer Film
Material CategoryPlastic
Component Size23 x 23mm
Component Length23mm
Component Width23mm
Number of Balls241
Length23mm
Ball Pattern17 x 17 P5-Row
Width23mm
Package Quantity10PK
Our Price: $129.00 PK
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
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