BGA REWORK STENCIL .006 17X17 P5-ROW 10/PKG
Hisco #:B6-241-2323-127-10123
MFG #:B6-241-2323-127
Our Price: $129.00 PK
Manufacturer Lead Time When Not In Stock: 7 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1
The CircuitMedic B6-241-2323-127 are 23 mm long rework stencils made of polymer film. The residue-free adhesive backing prevents solder paste bleeding and the disposable stencils are laser cut to ensure an accurate aperture size.
CircuitMedic B6-241-2323-127 Features:- Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
- Laser cut ensures precise aperture size
- Disposable - eliminates tedious stencil cleaning
- Flexible - conforms to board surface
- Fold-up sides for easy placement and solder paste containment
- Low cost
- Packaged in a handy ESD safe carrying case
- Product Type: Flextac Rework Stencils
- Applications: Applying Solder Paste for BGA Rework
- Type of Stencil: Flextac Rework
- Thickness: 0.006in
- Pitch: 1.27mm
- Material: Polymer Film
- Material Category: Plastic
- Component Size: 23 x 23mm
- Component Length: 23mm
- Component Width: 23mm
- Number of Balls: 241
- Ball Pattern: 17 x 17 P5-Row
- Package Quantity: 10PK
Product Description
Technical Information
Back to top
Product Description
The CircuitMedic B6-241-2323-127 are 23 mm long rework stencils made of polymer film. The residue-free adhesive backing prevents solder paste bleeding and the disposable stencils are laser cut to ensure an accurate aperture size.
CircuitMedic B6-241-2323-127 Features:- Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
- Laser cut ensures precise aperture size
- Disposable - eliminates tedious stencil cleaning
- Flexible - conforms to board surface
- Fold-up sides for easy placement and solder paste containment
- Low cost
- Packaged in a handy ESD safe carrying case
- Product Type: Flextac Rework Stencils
- Applications: Applying Solder Paste for BGA Rework
- Type of Stencil: Flextac Rework
- Thickness: 0.006in
- Pitch: 1.27mm
- Material: Polymer Film
- Material Category: Plastic
- Component Size: 23 x 23mm
- Component Length: 23mm
- Component Width: 23mm
- Number of Balls: 241
- Ball Pattern: 17 x 17 P5-Row
- Package Quantity: 10PK
Technical Information
Brand: CircuitMedic
Series: BGA
Product Type: Flextac Rework Stencils
Applications: Applying Solder Paste for BGA Rework
Type of Stencil: Flextac Rework
Thickness: 0.006in
Pitch: 1.27mm
Material: Polymer Film
Material Category: Plastic
Component Size: 23 x 23mm
Component Length: 23mm
Component Width: 23mm
Number of Balls: 241
Length: 23mm
Ball Pattern: 17 x 17 P5-Row
Width: 23mm
Package Quantity: 10PK
Our Price: $129.00 PK
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1