BGA REWORK STENCIL .008 16X19 FULL ARRAY 10/PKG

All-Spec #: B8-304-2125-127-10123 MFG #: B8-304-2125-127
$68.81
$69.50
Package-PK
Availability: 0 In Stock 7 days
0.00 lbs per PK
PK
1 Item must be ordered in multiples of 1
  • Product Information
  • Technical Information

The CircuitMedic B8-304-2125-127 are 21 mm long rework stencils made of polymer film. The residue-free adhesive backing prevents solder paste bleeding and the disposable stencils are laser cut to ensure an accurate aperture size.

CircuitMedic B8-304-2125-127 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
CircuitMedic B8-304-2125-127 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.008in
  • Aperture Size: 0.03in
  • Pitch: 1.27mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 21 x 25mm
  • Component Length: 21mm
  • Component Width: 25mm
  • Number of Balls: 304
  • Ball Pattern: 16 x 19 Array
  • Package Quantity: 10PK
  • Carton Quantity: 1
  • Series: BGA
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.008in
  • Aperture Size: 0.03in
  • Pitch: 1.27mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 21 x 25mm
  • Component Length: 21mm
  • Component Width: 25mm
  • Number of Balls: 304
  • Ball Pattern: 16 x 19 Array
  • Package Quantity: 10PK
  • Manufacturer: CircuitMedic