
WS-809 Water-Soluble Solder Paste, Sn63Pb37, 89.8-4-M19, 500g Jar
- 148990R-1998
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1 | $90.39 |
3 | $84.43 |
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- Product Information
- Technical Information
The Alpha 148990 is a Series WS809 solder paste with a flash point of 185.
The Alpha 148990 Features:- Excellent volume transfer efficiency over broad range of environmental conditions
- Fine-pitch printing with consistent shape and volume to 16 mil pitch QFP (63 x 10 x 5 mil deposits) and 15 mil circles (BGA225)
- High throughput and yield with consistent print volumes at print speeds ranging from 1 - 6 inches/second
- Exhibits resistance to slumping and drying at temperature up to 66 - 84°F (19- 29°C) and relative humidity extremes (35%-65% RH)
- Water cleanable after two paste reflow cycles
- Excellent low voiding performance that exceeds IPC Class III requirement
- Superior solder spread performance on Cu OSP
- Series: WS809
- Product Type: Solder Paste
- Physical Form: Paste
- Chemical Composition: Sn63Pb37
- Odor: Odorless
- Specific Gravity: 4.4g/cc
- Flash Point: 185°C
- Applications: Soldering, Desoldering
- Standards Met: IPC Class III, IPC J-STD-005, IPC J-STD-004A
- Container Type: Jar
- Capacity: 500g
- Country of Origin: Mexico
- Tariff Code: 3810.10.01
- Carton Quantity: 500
- Brand Name: Alpha
- Series: WS-809
- Chemical Composition: Sn63Pb37
- Product Type: Solder Paste
- Physical Form: Paste
- Odor: Odorless
- Specific Gravity: 4.4g/cc
- Flash Point: 185°C
- Applications: Soldering, Desoldering
- Standards Met: IPC Class III, IPC J-STD-005, IPC J-STD-004A
- Container Type: Jar
- Capacity: 500g
- Minimum Storage Temperature: 34
- Maximum Storage Temperature: 50
- Manufacturer: Alpha
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