OM-5300 No-Clean Tin-Lead Solder Paste, Sn63Pb37, 90-3-M17, 500g Jar

The Alpha 151855 is a Series OM5300 no-clean solder paste .

• Print Consistency:Lower "deposit to deposit" variation drives maximization of first pass print and reflow yields
• Fine Feature Capability:High print deposit volumes and low volume variability down to 12 mil (0.30mm) circle feature sizes
• Low BGA Voiding:Class III voiding resistance even when SAC 305 BGA spheres are used
• Electrical Reliability:Exceeds the requirements of the IPC and Bellcore SIR electrical reliability tests
• Suitable for fine pitch applications such as 0.5 mm (20mil) pitch Flip-Chip and 0201 assembly
• Excellent response to pause performance, generating fewer defects due to start up
• High print speed, up to 150 mm/sec (6 inch/sec)
• Efficient activation system providing defect free soldering with a wide range of oven profiles
• High yield for in circuit testing (low level of false negatives)
  

• Series: OM5300
• Product Type: No-Clean Solder Paste
• Physical Form: Paste
• Chemical Composition: Sn63Pb37
• Applications: Soldering
• Standards Met: IPC and Bellcore SIR, IPC J-STD-005, J-STD-004, DIN Standard 32 513
• Container Type: Jar
• Capacity: 500g

• Country of Origin: Mexico
• Tariff Code: 3810.10.01
• Carton Quantity: 500
• Brand Name: Alpha
• Series: OM-5300
• Chemical Composition: Sn63Pb37
• Product Type: No-Clean Solder Paste
• Physical Form: Paste
• Applications: Soldering
• Standards Met: IPC and Bellcore SIR, IPC J-STD-005, J-STD-004, DIN Standard 32 513
• Container Type: Jar
• Capacity: 500g
• Minimum Storage Temperature: 32
• Maximum Storage Temperature: 50
• Manufacturer: Alpha