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Flextac Rework Stencils, Aperture Size 0.01, 0.004

B4-048-0809-080-10123 MFG #: B4-048-0809-080
$87.03 / PK
Available to Order - 0 on Hand
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.004in
  • Aperture Size: 0.01in
  • Pitch: 0.8mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 8 x 9mm
  • Component Length: 8mm
  • Component Width: 9mm
  • Number of Balls: 48
  • Ball Pattern: 6 x 8 Array
  • Package Quantity: 10PC/PK
  • Storage Conditions: Ambient

The CircuitMedic B4-048-0809-080 is a flextac rework stencils with a pitch of 0.8.

The CircuitMedic B4-048-0809-080 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
The CircuitMedic B4-048-0809-080 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.004in
  • Aperture Size: 0.01in
  • Pitch: 0.8mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 8 x 9mm
  • Component Length: 8mm
  • Component Width: 9mm
  • Number of Balls: 48
  • Ball Pattern: 6 x 8 Array
  • Package Quantity: 10PC/PK
Pack: Package
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