BGA REWORK STENCIL .006 29X29 P9-ROW 10/PKG
Hisco #:B6-732-3737-127-10123
MFG #:B6-732-3737-127
Our Price: $179.00 PK
Manufacturer Lead Time When Not In Stock: 7 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1
The CircuitMedic B6-732-3737-127 are 37.5 mm long rework stencils made of polymer film. The residue-free adhesive backing prevents solder paste bleeding and the disposable stencils are laser cut to ensure an accurate aperture size.
CircuitMedic B6-732-3737-127 Features:- Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
- Laser cut ensures precise aperture size
- Disposable - eliminates tedious stencil cleaning
- Flexible - conforms to board surface
- Fold-up sides for easy placement and solder paste containment
- Low cost
- Packaged in a handy ESD safe carrying case
- Product Type: Flextac Rework Stencils
- Applications: Applying Solder Paste for BGA Rework
- Type of Stencil: Flextac Rework
- Thickness: 0.006in
- Aperture Size: 0.02in
- Pitch: 1.27mm
- Material: Polymer Film
- Material Category: Plastic
- Component Size: 37.5 x 37.5mm
- Component Length: 37.5mm
- Component Width: 37.5mm
- Number of Balls: 732
- Ball Pattern: 29 x 29 P9-Row
- Package Quantity: 10PK
Product Description
Technical Information
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Product Description
The CircuitMedic B6-732-3737-127 are 37.5 mm long rework stencils made of polymer film. The residue-free adhesive backing prevents solder paste bleeding and the disposable stencils are laser cut to ensure an accurate aperture size.
CircuitMedic B6-732-3737-127 Features:- Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
- Laser cut ensures precise aperture size
- Disposable - eliminates tedious stencil cleaning
- Flexible - conforms to board surface
- Fold-up sides for easy placement and solder paste containment
- Low cost
- Packaged in a handy ESD safe carrying case
- Product Type: Flextac Rework Stencils
- Applications: Applying Solder Paste for BGA Rework
- Type of Stencil: Flextac Rework
- Thickness: 0.006in
- Aperture Size: 0.02in
- Pitch: 1.27mm
- Material: Polymer Film
- Material Category: Plastic
- Component Size: 37.5 x 37.5mm
- Component Length: 37.5mm
- Component Width: 37.5mm
- Number of Balls: 732
- Ball Pattern: 29 x 29 P9-Row
- Package Quantity: 10PK
Technical Information
Brand: CircuitMedic
Series: BGA
Product Type: Flextac Rework Stencils
Applications: Applying Solder Paste for BGA Rework
Type of Stencil: Flextac Rework
Thickness: 0.006in
Aperture Size: 0.02in
Pitch: 1.27mm
Material: Polymer Film
Material Category: Plastic
Component Size: 37.5 x 37.5mm
Component Length: 37.5mm
Component Width: 37.5mm
Number of Balls: 732
Length: 37.5mm
Ball Pattern: 29 x 29 P9-Row
Width: 37.5mm
Package Quantity: 10PK
Our Price: $179.00 PK
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1