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BGA REWORK STENCIL .006 29X29 P9-ROW 10/PKG

Hisco #:B6-732-3737-127-10123

MFG #:B6-732-3737-127

Our Price: $179.00 PK
Manufacturer Lead Time When Not In Stock7 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1

The CircuitMedic B6-732-3737-127 are 37.5 mm long rework stencils made of polymer film. The residue-free adhesive backing prevents solder paste bleeding and the disposable stencils are laser cut to ensure an accurate aperture size.

CircuitMedic B6-732-3737-127 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
CircuitMedic B6-732-3737-127 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.006in
  • Aperture Size: 0.02in
  • Pitch: 1.27mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 37.5 x 37.5mm
  • Component Length: 37.5mm
  • Component Width: 37.5mm
  • Number of Balls: 732
  • Ball Pattern: 29 x 29 P9-Row
  • Package Quantity: 10PK

Product Description

The CircuitMedic B6-732-3737-127 are 37.5 mm long rework stencils made of polymer film. The residue-free adhesive backing prevents solder paste bleeding and the disposable stencils are laser cut to ensure an accurate aperture size.

CircuitMedic B6-732-3737-127 Features:
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
  • Laser cut ensures precise aperture size
  • Disposable - eliminates tedious stencil cleaning
  • Flexible - conforms to board surface
  • Fold-up sides for easy placement and solder paste containment
  • Low cost
  • Packaged in a handy ESD safe carrying case
CircuitMedic B6-732-3737-127 Specifications:
  • Product Type: Flextac Rework Stencils
  • Applications: Applying Solder Paste for BGA Rework
  • Type of Stencil: Flextac Rework
  • Thickness: 0.006in
  • Aperture Size: 0.02in
  • Pitch: 1.27mm
  • Material: Polymer Film
  • Material Category: Plastic
  • Component Size: 37.5 x 37.5mm
  • Component Length: 37.5mm
  • Component Width: 37.5mm
  • Number of Balls: 732
  • Ball Pattern: 29 x 29 P9-Row
  • Package Quantity: 10PK

Technical Information

BrandCircuitMedic
SeriesBGA
Product TypeFlextac Rework Stencils
ApplicationsApplying Solder Paste for BGA Rework
Type of StencilFlextac Rework
Thickness0.006in
Aperture Size0.02in
Pitch1.27mm
MaterialPolymer Film
Material CategoryPlastic
Component Size37.5 x 37.5mm
Component Length37.5mm
Component Width37.5mm
Number of Balls732
Length37.5mm
Ball Pattern29 x 29 P9-Row
Width37.5mm
Package Quantity10PK
Our Price: $179.00 PK
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
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