JP-501 Lead Free Solder Paste, Sn42Bi57.6Ag0.4, 85-5-M08, 100g Syringe

160063-1998 MFG #: 160063
$0.00 / SZ
Available to Order - 0 on Hand
  • Brand Name: Alpha
  • Series: JP-501
  • Chemical Composition: Sn42Bi57.6Ag0.4
  • Product Type: No-Clean Solder Paste
  • Physical Form: Paste
  • Applications: Soldering
  • Standards Met: Meets highest IPC 7095 III, RoHS Compliant, ROL0 Classification IPC J-STD-004, JIS Z 3197 1999, Bellcore GR78-CORE
  • Container Type: Syringe
  • Capacity: 30cc
  • Color: Gray
  • Container Size: 30 cc

The Alpha 160063 is a Series CVP-500 no-clean solder paste .

The Alpha 160063 Features:
  • Enables elimination of a second or third reflow cycle when temperature sensitive components or connectors are used
  • Reduces energy consumption in reflow ovens versus standard lead free alloys
  • Reduces reflow process cycle time
  • Delivers 8 Hour stencil life
  • Potential eliminations of bar solder, wave soldering flux and energy costs associated with wave soldering
  • Compatible with all commonly used lead free surface finishes (Entek HT, Alpha Star Immersion Silver, Immersion Tin, Ni/Au, SACX HASL, etc.)
  • Excellent resistance to random solder balling minimizing rework and increasing first time yield
  • Low temperature reflow profiles may enable the use of less expensive printed circuit board substrates, when appropriate
  • Meets highest IPC 7095 voiding performance (Class III)
  • Provides excellent electrical reliability properties
  • Zero halogen (no halogen intentionally added) and halide-free material
  • Compatible with either nitrogen or air reflow
The Alpha 160063 Specifications:
  • Series: CVP-500
  • Product Type: No-Clean Solder Paste
  • Physical Form: Paste
  • Chemical Composition: Sn42Bi57.6Ag0.4
  • Applications: Soldering
  • Standards Met: Meets highest IPC 7095 III, RoHS Compliant, ROL0 Classification IPC J-STD-004, JIS Z 3197 1999, Bellcore GR78-CORE
  • Container Type: Syringe
  • Capacity: 30cc
Pack: Syringe
QTY