OM-5300 No-Clean Tin -Lead Solder Paste, Sn63Pb37, 90-4-M18, 500g Jar
162714-1998
MFG #: 162714
Available to Order - 0 on Hand
- Brand Name: Alpha
- Series: OM-5300
- Chemical Composition: Sn63Pb37
- Product Type: No-Clean Solder Paste
- Physical Form: Paste
- Applications: Soldering
- Standards Met: IPC and Bellcore SIR, IPC J-STD-005, J-STD-004, DIN Standard 32 513
- Container Type: Jar
- Capacity: 500g
- Color: Clear
- Container Size: 500 g
- Storage Conditions: 45
The Alpha 162714 is a Series OM5300 no-clean solder paste .
The Alpha 162714 Features:- Print Consistency:Lower "deposit to deposit" variation drives maximization of first pass print and reflow yields
- Fine Feature Capability:High print deposit volumes and low volume variability down to 12 mil (0.30mm) circle feature sizes
- Low BGA Voiding:Class III voiding resistance even when SAC 305 BGA spheres are used
- Electrical Reliability:Exceeds the requirements of the IPC and Bellcore SIR electrical reliability tests
- Suitable for fine pitch applications such as 0.5 mm (20mil) pitch Flip-Chip and 0201 assembly
- Excellent response to pause performance, generating fewer defects due to start up
- High print speed, up to 150 mm/sec (6 inch/sec)
- Efficient activation system providing defect free soldering with a wide range of oven profiles
- High yield for in circuit testing (low level of false negatives)
- Series: OM5300
- Product Type: No-Clean Solder Paste
- Physical Form: Paste
- Chemical Composition: Sn63Pb37
- Applications: Soldering
- Standards Met: IPC and Bellcore SIR, IPC J-STD-005, J-STD-004, DIN Standard 32 513
- Container Type: Jar
- Capacity: 500g