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EM907 Series Lead Free No-Clean Solder Paste, Type 3, SAC305, 500g Jar

70-0605-0810-16600 MFG #: 70-0605-0810
$95.63 / JR
Available to Order - 0 on Hand
  • Brand Name: Kester
  • Series: EM907
  • Chemical Composition: Sn96.5Ag3.0Cu0.5
  • Product Type: No-Clean Solder Paste
  • Physical Form: Paste
  • Odor: Mild
  • Applications: Soldering
  • Standards Met: Classified as ROL0 per J-STD-004, J-STD-004, IPC-TM-650, RoHS Compliant
  • Container Type: Jar
  • Capacity: 500g

The Kester 70-0605-0810 is a Series EM907 no-clean solder paste .

The Kester 70-0605-0810 Features:
  • Lead free joints that closely resemble those achieved with SnPb solder paste
  • Excellent solderability to a wide variety of surface metallizations, including Ni/Au, Im Sn and Im Ag
  • High print speeds up to 150 mm/s
  • Capable of 60 minute break times in printing
  • Stencil life:12+ hours (process dependent)
  • Excellent printing characteristics to 16 and 20 mils pitch
  • Excellent print and reflow characteristics for 0201 applications
  • Stable tack life
  • Classified as ROL0 per J-STD-004
The Kester 70-0605-0810 Specifications:
  • Brand: Kester®
  • Series: EM907
  • Product Type: No-Clean Solder Paste
  • Physical Form: Paste
  • Chemical Composition: SAC 305
  • Odor: Mild
  • Applications: Soldering
  • Standards Met: Classified as ROL0 per J-STD-004, J-STD-004, IPC-TM-650, RoHS Compliant
  • Container Type: Jar
  • Capacity: 500g
Pack: Jar
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