NXG1 Series Lead Free No-Clean Solder Paste, Type 3, SAC305, 500g Jar

70-3213-0810-16600 MFG #: 70-3213-0810
$0.00 / JR
Available to Order - 0 on Hand
  • Brand Name: Kester
  • Series: NXG1
  • Chemical Composition: Sn96.5Ag3.0Cu0.5
  • Product Type: No-Clean Solder Paste
  • Physical Form: Paste
  • Odor: Mild
  • Applications: Soldering
  • Standards Met: IPC ANSI/J-STD-004B, ANSI/J-SDTD-005 Compliant, IPC-TM-650, RoHS Compliant
  • Container Type: Jar
  • Capacity: 500g

The Kester 70-3213-0810 is a Series NXG1 no-clean solder paste .

The Kester 70-3213-0810 Features:
  • Excellent wetting to a variety of metals
  • Capable of print speeds up to 200 mm/sec (8 in/sec)
  • Excellent printing characteristics on 0.4mm (16 mil) pitch QFPs
  • Excellent release from stencil
  • Long stencil and tack life (process dependent)
  • Low voiding behavior
  • Capable of 120 minute break times in printing
  • Clean cosmetic aesthetics after reflow
  • Resistant to slump
  • Longest shelf life at 8 months
  • Reflowable in air or nitrogen
The Kester 70-3213-0810 Specifications:
  • Brand: Kester┬«
  • Series: NXG1
  • Product Type: No-Clean Solder Paste
  • Physical Form: Paste
  • Chemical Composition: SAC 305
  • Odor: Mild
  • Applications: Soldering
  • Standards Met: IPC ANSI/J-STD-004B, ANSI/J-SDTD-005 Compliant, IPC-TM-650, RoHS Compliant
  • Container Type: Jar
  • Capacity: 500g
Pack: Jar
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