Epoxy Flux Technology - Tacky Flux with Value Added Benefits
This article is based on an original publication by Loctite.
Introduced more than 30 years ago, underfills have supported many modern advancements which would not have otherwise been possible. Sustained developments - such as filler technology, increased control of flow rates, new cure mechanisms, improved modular properties, and alternative application techniques - continue to introduce enhanced capabilities to the industry. However, as the market maintains its trend toward increasingly flexible and reliable miniaturized devices and components, underfill system capabilities will require continued enhancements.
Currently, the most common types of underfills used are capillary flow materials, fluxing (noflow) underfills, cornerbond and edgebond systems. While each is viable for certain applications, newer components will benefit from an inventive underfill material technology - called epoxy flux - in the reflow cured encapsulate class. This new material system is enhancing applications from semiconductor packaging to PCB assembly.
Epoxy Flux Underfill Technology
Developed for process efficiency, this material system provides a flux component to enhance solder joint formulation in conjunction with an epoxy system that protects components and devices by encapsulating individual bumps. Cured during the reflow process itself, epoxy fluxes provide an in-line alternative to other underfill mechanisms to eradicate the requirement for a dedicated dispensing system and its associated time requirements.