Offer valid only in the continental U.S. on orders totaling $199 or more, excluding all taxes and fees. Orders must ship FedEx Ground Parcel Prepaid. Shipping charges will apply for the following types of products: products that are overweight/oversized, products with HAZMAT restrictions, products that must ship expedited and/or products that must ship expedited due to temperature requirements.
Click to close out this message
Solder Materials Science Gets Small as Miniaturization Challenges Old Rules
This article is based on an original publication by Henkel Corporation.
Extreme miniaturization in a high-volume, high-reliability production environment is one of the electronics assembly industry's most significant challenges to date. While many process variables can be impacted, possibly none is affected as much as the solder process. With new tighter pitches and smaller geometries, soldering materials must also maintain lead-free properties as well as high temperature compatibility, humidity resistance, and more.
Particles the Pack a Punch
Traditional Type 3 solder pastes are increasingly less capable of addressing small deposit volume requirements. However, moving to Type 4 paste will not necessarily solve the problem, and it is thus critical that today's Type 4 materials are optimized for extreme miniaturization.